Kirk D. Prall (M'82) was born in 1958. He received the Ph.D. degree in electrical engineering from the University of New Mexico, Albuquerque, in 1990. He worked for Philips Semiconductors from 1982 to 1991, in the areas of EPROM, ROM, microprocessors. He joined Micron, Inc., Boise, ID, in 1991 working on DRAM, NOR, NAND, and emerging memories. He retired from Micron in 2019 and is currently writing engineering books. He has published several papers and holds more than 200 patents.
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CMOS Plasma and Process Damage
Kirk Prall
Chapter 1. BACKGROUND.- Chapter 2. THE ANTENNA EFFECT.- Chapter 3. DIODE AND TRANSISTOR PROTECTION.- Chapter 4. SIGNATURES OF PROCESS DAMAGE.- Chapter 5. ELECTRICAL SIGNATURES OF PROCESS DAMAGE.- Chapter 6. LATENT DAMAGE AND RELIABILITY DEGRADATION.- Chapter 7. ATOMIC-LEVEL DEFECTS AND ELECTRICAL EFFECTS.- Chapter 8. TECHNOLOGY SPECIFIC PROCESS DAMAGE.- Chapter 9. COMMON SOURCES OF PROCESS DAMAGE.- Chapter 10. INLINE PROCESS DAMAGE MEASUREMENTS.- Chapter 11. PROCESS DAMAGE TEST STRUCTURES.- Chapter 12. DESIGN RULES...
