Cover: Electronic Materials Innovations and Reliability in Advanced Memory Packaging (E-Book) von Chong Leong Gan
Chong Leong Gan

Teil der Reihe: Chemistry and Material Science (R0)

Electronic Materials Innovations and Reliability in Advanced Memory Packaging

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Inhaltsangabe

Influences of Electronic Materials Properties on Packaging Reliability.- Mechanical and Thermal Stress of Encapsulant and New Materials in Memory Packaging.- Materials Development for Future Data Center Applications.- Advanced Chiplets and Heterogenous Integration in Memory Device Packaging.- Hybrid Bonding Device Packaging.- Hardware Reliability for Memory Modules and SSDs.- Innovative Sustainable Electronics Materials in Advanced Memory Packaging.- PCB and Substrate in Future Memory Applications.

Produktdetails
  • Erscheinungsdatum: 21.07.2025
  • Autor/Autorin: Chong Leong Gan,Chen Yu Huang
  • Reihe: Chemistry and Material Science (R0)
  • Format: E-Book
  • Dateiformat: PDF
  • Kopierschutz: Wasserzeichen
  • Dateigröße: 14.2 MB
  • Verlag: SPRINGER
  • Sprache: Englisch
  • Umfang: 178 Seiten
  • ISBN: 9783031947957
  • Lieferung: Sofort per Download
  • Hinweis: Sofort per Download lieferbar. Kein physischer Versand.
  • Kompatibilität: Lesbar auf Geräten und Apps mit PDF-Unterstützung.
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