Platzhalterbild für Wei-Ting Kary Chien

Wei-Ting Kary Chien

Dr. Wei-Ting Kary Chien has held positions with Intel, TSMC, STMicroelectronics, SMIC, and Centrillion Technologies as Q&R Head, Director/VP (Q&R), and General Manager in charge of technologies from IDM to Foundries, memory bio-chip, logic, and MEMS, managing quality and reliability of electronics from 2um to 2nm technologies. He has also served as an Adjunct Professor of Electrical Engineering at City University of Hong Kong as well as Electrical Engineering at Shanghai Jiaotong University.

Dr. Chien has co-authored two technical books and holds more than 80 patents in US, Taiwan, and China. An IEEE Fellow, he has provided services to professional societies and technical journals in various capacities.

Dr. Way Kuo is a Senior Fellow of Hong Kong Institute for Advanced Study, Emeritus President and University Distinguished Professor at City University of Hong Kong. He has held the endowed Wisenbaker Chair of Engineering in Innovation at Texas A&M University and served on the senior management team of Oak Ridge National Laboratory. A pioneer in designing reliability for electronics systems at the infant stage, he has been employed by Bell Labs and as a reliability consultant for IBM, TI, Motorola, and other high-tech companies.

Dr. Kuo is a member of National Academy of Engineering and an IEEE Life Fellow. He has served as the Editor-in-Chief of IEEE Transactions on Reliability from 1999 to 2015.

Reliability and Yield in Nanoelectronics Manufacturing Erschienen am 14.07.2026

Reliability and Yield in Nanoelectronics Manufacturing

E-Book

Part I. Build-In Reliability.- The IC Industry.- Quality & Reliability Activities in the IC Lifecycle.- The BIR Framework.- The Enriched BIR (eBIR).- Implementation of the BIR Framework.- Key Takeaways.- Part II. Completeness.- Team Players on Semiconductor Quality & Reliability.- Quality Engineering in Semiconductor Manufacturing.- Quality & Reliability Training.- Key Takeaways.- Part III. Timeliness.- Early Detections.- Baseline Management.- Using Wafer-Level Tests instead of PLR Tests.- IC Evaluations and Qualifications.- Key Takeaways.- Applying AI Techniques in Semiconductor Manufacturing.- Advanced Packaging.- Prognostics and Health Management.- DEI & Globalization.- Key Takeaways.- Appendix.- Index.

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